Item

Technical Parameter

Remark

Layers

1-20

Board thickness

0.2-10mm

Min. Inner Layer Board

Thickness

0.10mm

Core

Max. Board Size

560×900mm

/

Min. Line Width

2.5mil

/

Min. Space

2.5mil

/

Min. Through Hole Size

0.1mm

Finished

PTH Wall Thickness

0.025mm

/

PTH Hole Dia. Tolerance

+/- 0.05mm

φ ≤ 0.8mm

+/- 0.08mm

φ > 0.8mm

NPTH Hole Dia. Tolerance

+/- 0.05mm

/

Hole Position Deviation

+/- 0.05mm

/

Outline Tolerance

+/- 0.10mm

/

Board thickness /

hole diameter

8:1

/

Solder mask thickness

8-30um

Bow and twist

≤2.0%

residual copper rate difference between 

symmetry layers is <60%

≤1.0%

residual copper rate difference between 

symmetry layers is 35%- 60%

≤0.75%

residual copper rate difference between 

symmetry layers is<= 35%

Twist and bend

≤ 0.7%

/

Peel Strength

＞ 1.4N/mm

/

Thermal Stress

3*10 Sec@288℃

/

Flammability

94V-0

/

Surface Treatment

HAL,HASLlead free,

OSP,Imm.Gold,Imm.

Si ver,Imm.Tin,Gold finger,

 Hard gold

/

Special Processes

carbon oil ,peelable mask

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